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Patent AT-E399830-T1: [Translated] SOLVENT-FREE PRESSURE-SENSITIVE SILICONE ADHESIVES WITH IMPROVED HIGH-TEMPERATURE COHESION
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Updated Oct 29, 2026
About this dataset
This invention relates to silicone compositions suitable for forining pressure sensitive adhesives. More particularly, the present invention relates to solventless curable PSA compositions suitable for forming pressure sensitive adhesive compositions having improved high temperature cohesive strength while maintaining good tack and adhesive properties.
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Access the complete Patent AT-E399830-T1: [Translated] SOLVENT-FREE PRESSURE-SENSITIVE SILICONE ADHESIVES WITH IMPROVED HIGH-TEMPERATURE COHESION on the official website.
Modified Jun 29, 2026