Patent AT-E40157-T1: [Translated] SELECTIVE PLATING.

A method of selective plating a component such as a header (3), wherein the header (3) is mounted in a jig (7), a resilient silicone rubber mask (1) having a stepped plating aperture (2) is press fitted to the cap (4) of the header (3) and a beading (12) of the jig (7) so as to expose only the end face of the cap (4) and the ends of the lead wires (5) of the header (3), the assembly is inverted over a plating tank in a selective plating machine, the end face of the cap (4) and the lead wire ends (5) are selectively plated, for example with gold, and the resilient mask (1) is peeled away from the header (3).